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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packa

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packa

by Wei, Xing-Chang
No customer reviews yet ISBN 9780367573669 CRC Press

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BrandCRC Press
Pub dateJun 30, 2020
ISBN-100367573660
ISBN-139780367573669
Paperback322.0 pages
LanguageEnglish
Dimensions9.21 × 6.14 × 0.71 in
Weight1 lb
Last updated 2026-08-16 23:29
$69.94
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