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Tin and Solder Plating in the Semiconductor Industry (1993)
Tin and Solder Plating in the Semiconductor Industry (1993)
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ISBN 9780412482403
Springer
- Published
- Nov 1992
- Language
- English
- Size
- 9.21 × 0.81 × 6.14 in
$260.17
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Brand New
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About this book
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Specifications
PublisherSpringer
PublishedNov 30, 1992
ISBN-100412482401
ISBN-139780412482403
LanguageEnglish
Dimensions9.21 × 0.81 × 6.14 in
Weight3 lb
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