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Semiconductor Wafer Bonding: Science and Technology

Semiconductor Wafer Bonding: Science and Technology

by Tong, Q -Y
No customer reviews yet ISBN 9780471574811 Wiley-Interscience

Bonding - eine Technik zum "Verschweißen" von Halbleiter-Wafers ohne "Klebstoff" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur Wärmebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01/99)

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BrandWiley-Interscience
Pub dateDec 7, 1998
ISBN-100471574813
ISBN-139780471574811
LanguageEnglish
Dimensions9.69 × 0.77 × 6.46 in
Weight1 lb
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