Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Presents a set of production guidelines for reliable microelectronic packages such as microprocessors and memory chips. Furnishes an organized, disciplined and time-phased approach to the design, development, qualification, manufacturing, and in-service management of a product for achieving successful performance as well as safety, supportability and cost-effectiveness. Offers realistic methods for meeting system requirements under a variety of environmental conditions. Shows how to identify potential failure sites and mechanisms.