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Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (1999)

Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (1999)

by Kelly, Gerard
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Pub dateApr 30, 1999
ISBN-100792384857
ISBN-139780792384854
LanguageEnglish
Last updated 2026-09-02 03:53
$114.64
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