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Direct Copper Interconnection for Advanced Semiconductor Technology
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Direct Copper Interconnection for Advanced Semiconductor Technology

No customer reviews yet ISBN 9781032528236 CRC Press
Published
Jun 2024
Language
English
Size
9.21 × 6.14 × 1.01 in
$260.17
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About this book

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

Specifications

PublisherCRC Press
PublishedJun 28, 2024
ISBN-101032528230
ISBN-139781032528236
LanguageEnglish
Dimensions9.21 × 6.14 × 1.01 in
Weight2 lb

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