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3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility
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ISBN 9781119289647
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
- Provides chapter-wise review questions and powerpoint slides as teaching tools
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Product details
Pub dateJul 18, 2018
ISBN-101119289645
ISBN-139781119289647
LanguageEnglish
Last updated 2026-04-25 02:12
$234.19
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Delivery by Thursday, October 1, 2026
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