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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packa

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packa

by Wei, Xing-Chang
No customer reviews yet ISBN 9781138033566

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Pub dateMay 25, 2017
ISBN-101138033561
ISBN-139781138033566
LanguageEnglish
Last updated 2026-09-24 13:13
$257.05
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