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Copper Electrodeposition for Nanofabrication of Electronics Devices (Softcover Reprint of the Origin
Copper Electrodeposition for Nanofabrication of Electronics Devices (Softcover Reprint of the Origin
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ISBN 9781493953738
Springer
- Published
- Aug 2016
- Language
- English
- Size
- 9.25 × 0.66 × 6.1 in
$93.85
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About this book
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: - ULSI wiring material based upon copper nanowiring - Printed circuit boards - Stacked semiconductors - Through Silicon Via - Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Specifications
PublisherSpringer
PublishedAug 23, 2016
ISBN-101493953737
ISBN-139781493953738
Paperback290.0 pages
LanguageEnglish
Dimensions9.25 × 0.66 × 6.1 in
Weight1 lb
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