Skip to content
Home/ Optical Polymer Waveguides: From the Design to the Final 3d-Opto Mechatronic Integrated Device (2022
Optical Polymer Waveguides: From the Design to the Final 3d-Opto Mechatronic Integrated Device (2022

Optical Polymer Waveguides: From the Design to the Final 3d-Opto Mechatronic Integrated Device (2022

No customer reviews yet ISBN 9783030928537

Light signals in optical waveguides can be used to transmit very large amounts of data quickly and largely without interference. In the industrial and infrastructural sectors, e.g. in the automotive and aerospace industries, the demand to further exploit this potential is therefore increasing. Which technologies can be used to effectively integrate systems that transmit data by means of light into existing components? This is a central question for current research. So far, there have been some technical limitations in this regard. For example, it is difficult to couple the signal of an optical waveguide to other optical waveguides without interruption. There is also a lack of suitable fabrication technologies for three-dimensional waveguides, as well as design and simulation environments for 3D opto-MID. This book addresses these and other challenges.

About the author

Product details

Pub dateDec 7, 2022
ISBN-103030928535
ISBN-139783030928537
LanguageEnglish
Last updated 2026-08-30 01:52
$145.82
Only 5 left in stock — order soon
Delivery by Monday, September 14, 2026
Qty
Sign in to Add to Saved list
Free delivery on orders over $35.
15-day returns. Any reason.
Secure checkout. We never store card details.

Readers who bought this also bought

More from Microwaves
See all
Directions for the Next Generation of MMIC Devices and Systems (1997)
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel, and multifunctional integration, cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measure- ment and testing techniques, as weil as material and fabrication technologies, are being di- rected to meet these new challenges. Continuing on the series ofsymposia sponsored by the Weber Research Institute of Polytechnic University, an international symposium focusing on the current developments and new research initiatives for the next generation ofmicrowave and millimeter wave inte- grated circuits and systems was held at Brooklyn, New York, during September 11-13, 1996. The symposium was organizedas a3-dayevent, running mostly ina single-session format of regular papers and panel discussions, It was co-sponsored by the Army Research Office, Re- search Triangle Park, NC, in cooperation with the IEEE Microwave Theory and Techniques Society, the IEEE Antennas and Propagation Society, and IEEE Long Island and New York MetropolitanSections.The papers published in this volume are extended versionsofselected papers presented at this symposium.
$177.01