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Wafer Bonding: Applications and Technology (2004)

Wafer Bonding: Applications and Technology (2004)

by G÷sele, U.
No customer reviews yet ISBN 9783540210498 Springer

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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BrandSpringer
Pub dateMay 14, 2004
ISBN-103540210490
ISBN-139783540210498
LanguageEnglish
Dimensions9.2 × 1.3 × 6.1 in
Weight2 lb
Last updated 2026-03-19 02:39
$395.30
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