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Electrical Design of Through Silicon Via (Softcover Reprint of the Original 1st 2014)
by Electrical Design of Through Silicon Via (Softcover Reprint of the Original 1st 2014)
$114.84
Description
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
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Product Details
- Springer Brand
- Sep 27, 2016 Pub Date:
- 9789401779494 ISBN-13:
- 940177949X ISBN-10:
- English Language
- 9.25 in * 0.66 in * 6.1 in Dimensions:
- 1 lb Weight:
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