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DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS WSPC Series in Advanced Integration and Packaging 2
by [Madhavan Swaminathan & Ki Jin Han]
$141.65
Description
Last updated on
Product Details
- World Scientific Pub Co I Brand
- Jan 1, 2014 Pub Date:
- 9789814508599 ISBN-13:
- 9814508594 ISBN-10:
- 354.0 pages Hardcover
- English Language
- 9 in * 1 in * 6 in Dimensions:
- 1 lb Weight:
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