Flip Chip Hybrid Bonding Fan In and Fan Out Technology
by [Lau, John H.]
$204.15
Description
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.
The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
Product Details
- Springer Brand
- May 24, 2024 Pub Date:
- 9789819721399 ISBN-13:
- 9819721393 ISBN-10:
- 521.0 pages Hardcover
- English Language
- 9.35 in * 1.11 in * 6.43 in Dimensions:
- 2 lb Weight:
Money Back
Love it! Use it! Reuse it!
Free Shipping
Shipping is on us
Free Support
24/24 available
