Skip to content
Home/ Multibeam Phased Array Antennas as Satellite Constellation Ground Station (2024)
Multibeam Phased Array Antennas as Satellite Constellation Ground Station (2024)

Multibeam Phased Array Antennas as Satellite Constellation Ground Station (2024)

No customer reviews yet ISBN 9789819979097 Springer

This book focuses on the multi-beam phased array antenna as a satellite ground station. As there are already many excellent books on phased array antennas in the literature, this book focuses mainly on some engineering practices and fills the gap between principles and practices, such as array excitation error impact analysis and calibration methods, array geometry design for hemispherical coverage, multiple beam resource management, etc. This book is particularly suitable for readers interested in satellite constellation design or satellite ground station design. This book also benefits researchers and engineers in the fields of phased array antennas, aerospace engineering, telecommunications, etc.

About the author

Product details

BrandSpringer
Pub dateNov 22, 2023
ISBN-109819979099
ISBN-139789819979097
Hardcover113.0 pages
LanguageEnglish
Dimensions9.21 × 0.31 × 6.14 in
Weight1 lb
Last updated 2026-04-25 15:23
$135.43
In stock — ships in 24 hours with free tracking
Delivery by Monday, September 14, 2026
Qty
Sign in to Add to Saved list
Free delivery on orders over $35.
15-day returns. Any reason.
Secure checkout. We never store card details.

Readers who bought this also bought

More from Microwaves
See all
Directions for the Next Generation of MMIC Devices and Systems (1997)
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel, and multifunctional integration, cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measure- ment and testing techniques, as weil as material and fabrication technologies, are being di- rected to meet these new challenges. Continuing on the series ofsymposia sponsored by the Weber Research Institute of Polytechnic University, an international symposium focusing on the current developments and new research initiatives for the next generation ofmicrowave and millimeter wave inte- grated circuits and systems was held at Brooklyn, New York, during September 11-13, 1996. The symposium was organizedas a3-dayevent, running mostly ina single-session format of regular papers and panel discussions, It was co-sponsored by the Army Research Office, Re- search Triangle Park, NC, in cooperation with the IEEE Microwave Theory and Techniques Society, the IEEE Antennas and Propagation Society, and IEEE Long Island and New York MetropolitanSections.The papers published in this volume are extended versionsofselected papers presented at this symposium.
$177.01